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Physics of Failure and Reliability of Microelectronic Packages
EMA 5937C (3 Credit Hours)

Fridays 5:00 - 7:50 PM
Florida Solar Energy Center Auditorium

Instructor: Neelkanth G. Dhere.

Objective: To study electronic devices reliability in the context of Physics of Failure and reliability. Outline: Electronic Devices and their Reliability, Failure Frequency, Bath Tub Curve and Failure, Defect, Contaminants, and Yield, Mathematics of Failure and Reliability, Failure Models, Exponential, Log Normal, Weibull Distribution, Purpose of Packaging, Typical Configurations, Criteria for Component Selection, Pottant or Encapsulant, Environmental Damage of Electronic Products, Acceleration Testing, Electronic Packaging & Failures, Electrochemical Corrosion, Delamination, Solder Bond Failures, Failure Prevention, Future Direction & Reliability Issues.